On the Intel server CPU roadmap, the Intel Xeon family is launching the new dual-core CPU core named Dempsey righ after the phase-out of the Nocona and Irwindale cores. In 2006, Thermaltake Technology is presenting two solutions for both 1U and 2U systems for the Dempsey core: the CL-P0263 will be the 1U passive heatsink, while the CL-P0303 will be the active heatpipe cooling solution.

Both coolers follow the design of the latest LGA771 Pin feet specifications. Using the high thermal conductivity nature of an all-copper heatsink, the coolers can quickly transfer the heat produced from the CPU to the body of the heatsink and be blown away by the fan. The CL-P0263 is a passive heatsink designed especially for 1U systems. Its high-density fins, all-copper structure, and seamless soldering processes will provide excellent cooling results for the next generation Xeon CPUs.

In the 2U arena, active heat dissipating solutions are the main trend. The CL-P0303 heatsink utilizes two heatpipes soldered onto the fins of the unit. Utilizing the heatpipe's special properties to quickly conduct the heat of the CPU to the fins of the cooler, the CL-P0303 utilizes a 70 x 70 x 15 mm spinning at 3,600 RPM to achieve the best cooling without outputing excess nosie pollution.

With the way Thermaltake Technology is pushing for more efficient and different coolers for every application, we believe that these two new coolers will perform beautifully for the consumers out there, bringing smoother and more stable servers to the world.