Thermaltake Technology is prepared to launch the heatsink for the upcoming AMD Opteron Socket F CPU releasing in August, 2006. Thermaltake is already deep in the research and development of Socket F products for both 1U and 2U systems.

Specifically for 1U systems, Thermaltake is presenting 2 new coolers. The first is the CL-P0317 which is an all-copper, passive cooler that utilizes springs and backplate combination. The CL-P0316, on the other hand, adds a special hanging 7010 fan to help dissipate the heat faster. The structure of the hanging 7010 fan enables a reduced turbulence and backpressure on the heatsink, allowing maximum heat dissipation and lowest noise produced in a 1U setting.

Specifically for Socket F 2U systems, Thermaltake is proud to present three versions of coolers utilizing heatpipe technology. The main purpose of this design is to cool the high power consumption processor that the Socket F is as much as possible. The CL-P0314 is the active cooler utilizing 7015 thermal fan. The CL-P0315 is the passive heatsink that maximizes surface area and thermal dissipation of the CPU. The 2 heatsinks mentioned above are produced using the extremely high standard brazing process. Combined with 4 heatpipes each, these coolers achieve the highest heat dissipation possible.

Thermaltake attunes to the consumers’ convenience at the same time, provide AMD Socket F retention frames and backplates.