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Intel LGA 775
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Low Noise
Performance
Excellent ratio aluminum extrusion heatsink for better heat dissipation.
Pure Copper Core for base.
Optimized solution.
Tool-free clip and easy installation.
Top View
AL+ Cu Heat Sink
Side View
Model
CLP0515
Compatibility
Athlon 64 X2 :ADA 3600-6000
Athlon 64 FX :ADAFX 62i – 72i
Athlon 64 : ADA 3000-4000
Sempron : SDA 2800-3800
Dimension
(L)77.0 x (W)75.5.0 x (H)53 mm
Fan Dimension
80mm x 80mm x 25mm
Heat Sink Material
Aluminum Extrusion + Copper Core
Rated Voltage
12V
Operating Range
7.0~13.2 V
Rated Current
0.18 A
Rated Speed
2600 rpm ± 10%
Air Flow
30.9 CFM
Static Pressure
2.54mm H
2
O
Noise Level
30.8 dBA
Connector
3 Pin
Bearing
Rife Bearing
Life expectancy
40,000 Hrs
Weight
284 g
Thermal Interface Material
ShinEtsu AD66
Thermal Resistance
0.476
o
C/W
"Tt", Thermaltake, Thermaltake are trademarks of Thermaltake Technology Co., Ltd.
All other registered trademarks belong to their respective companies.
