Sideward flow design for HTPC chassis, POS system, IPC system and SFF system.
Heat pipe provides excellent thermal conduction and increase the fin efficiency.
High density aluminum fin array: Good fin efficiency and provides more surface area for heat dissipation.
Seamless soldering process ensure the best bonding for conduction heat transfer.
Push-pin design for easy install.
Top View
Copper Base
Aluminum Fins
Push Pin
Model
CLP0533
Compatibility
Intel Core i7 Processor 900 series
Dimension
(L)96.3 x (W)98.1 x (H)79.4 mm
Fan Dimension
70 x 70 x 15 mm
Heat Sink Material
Aluminum Fin +Cooper Base +Heat pipe
Heat Pipe
Ø 6mm x 2 pieces
Rated Voltage
12 V
Operating Voltage
Range
10.8 ~ 13.2 V
Rated Current
0.45 A (Max)
Rated Speed
1200 ~ 6000 RPM
Air Flow
9.40 ~ 46.98 CFM
Static Pressure
0.36 ~ 8.94mmH2O
Noise Level
19 ~ 48 dBA
Speed Controlled Type
PWM
Connector
4 Pin
Bearing
1 Ball & 1 Sleeve
Life expectancy
40,000 Hrs
Weight
490 g
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