Aluminum material, improve heat
transfer and protect memory chips from
damage
Specialized-design for front and rear
heat spreader to hook firmly
Bergquist GP1500& GP500 provide
better heat transmission
Easy installation
Used for memory in Xeon series server
Model
CL-R0021
Compatibility
Aluminum
Dimension
<Front Side>
133.35 x 26 x 1.12 mm <Back Side>
133.35 x 23.5 x 1.mm
Memory thermal pad
Bergquist GP1500
Chip thermal pad
Bergquist GP500
Net Weight
17 g
Heat-spreader
"Tt", Thermaltake, Thermaltake are trademarks of Thermaltake Technology Co., Ltd.
All other registered trademarks belong to their respective companies.
