Application for Intel 1U Dempsey (1066MHz FSB, LGA 771)
Spring Screw
All copper, Tiny Fin Technology
Dow Corning 5022 interface material, the best cooling performance
Cu Base w/ Cu Fin
Spring Screw
Model
CL-P0263
Socket Type
LGA 771
Heatsink Dimension
86.9 x 78.7 x 20.5 mm
Heatsink Material
Cu Base w/ Cu Fin
Fastener
Spring Screw
Interface Material
Dow Corning 5022
Weight
530 g
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