Dense copper fin, copper base with seamless solding process
Spring Screw design, easy to install
Dow Corning TC-5022, perform well
Bundle with Tt Socket F Metal back plate
Supports Socket F with 4.1” mounting pitch (104.14mm)
Spring Screw
Copper Base
High Density Copper Fin
Tt Socket F Back plate
P/N: CL-O0010
Model
CL-P0317
Compatibility
- AMD Opteron 2000 series Socket F(1207)
Recommended System
1U Rackmount System
Heatsink Dimension
(L, W, H)
115 x 74 x 27 mm
Heatsink Material
All Copper
Interface Material
Dow Corning TC-5022
Weight
498 g
"Tt", Thermaltake, Thermaltake are trademarks of Thermaltake Technology Co., Ltd.
All other registered trademarks belong to their respective companies.
