Application for Intel Woodcrest 1U Passive
Solution
All Aluminum fin and base soldering Technology
High density fins provide better heat dissipation
Dow Corning 5022 Interface material performs well
Base View
Top View
High-density Fin
Spring screw
Model
CL-P0389
Application System
1U Rackmount System
Processor Type
Intel Xeon Clovertown/
Woodcrest series:
Intel Xeon 51XX Series
Intel Xeon E5300 Series
Socket Type
LGA 771
Heatsink Dimension
88.9 x 78.7 x 27mm
Heatsink Material
Al. Base w/ Al. Fin
Fastener
Spring Screw
Interface Material
Dow Corning 5022
Weight
189 g
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