HomeAbout I.T.BUProductNewsTechnologyDownloadContact Us
 

TR2 Cooler

Desktop Solution

Server Solution

Embedded Solution

Liquid Cooling System (L.C.S.)

VGA Solution

Memory Solution

Accessory Solution

DC FAN
Solution


Customized Design

 

 

 

 

 


 

 
Product > Server Solution > AMD 1U >
 
   
   
 
Performance
Low Noise
Copper Base
Copper Fins
RoHS
 

 

Application for AMD Socket G34 1U Server.
All copper fin soldered with copper base by seamless soldering process.
Spring screw provide robust fixing with board during shipping.
High density copper fin array: Good fin efficiency and provides more surface area for heat dissipation.
Pre-applied thermal grease is convenient for installation.
   




 
Top View
 
Bottom View
 
Front View
 
Spring-screw

 
 

Model
CLS0014
Compatibility AMD Socket G34 CPU
Dimension (L)115.5 x (W)74.0 x (H)26.7 mm
Heat Sink Material Copper Base Soldered Copper Fin Array
Weight 504.5g
Type of Fixing Spring / Screw
   
   
   
   
"Tt", Thermaltake, Thermaltake are trademarks of Thermaltake Technology Co., Ltd.
All other registered trademarks belong to their respective companies.