Aluminum fin array soldered with copper base and heat pipes by seamless soldering process.
Spring screw provide robust fixing with board during shipping.
Heat pipe provides excellent thermal conduction and increase the fin efficiency.
High density copper fin array: Good fin efficiency and provides more surface area for heat dissipation.
Pre-applied thermal grease is convenient for installation.
Top View
Bottom View
Front View
Spring-screw
Model
CLS0016
Compatibility
AMD Socket G34 CPU
Dimension
(L)115 x (W)80.5 x (H)35.0 mm
Heat Sink Material
Copper Base Soldered Aluminum Fin Array
Heat Pipe
Ø 6mm x 4 pieces
Weight
430.4g
Type of Fixing
Spring / Screw
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