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Discontinued Products
 
Product > Server Solution > Intel 2U >
 
   
 
Patent Information
Country Patent No.
Taiwan
M286920
China
ZL 2005 2 0133757.4
 
   
Performance
Heatpipe x 2
Low Noise
   
 


 

Application for Intel Xeon Dempsey 2U active solution
Low noise and silent server cooler
All copper solding Technology
Heat-pipe designation provides better heat conductivity
Dow Corning 5022 Interface material performs well



 

 
Spring Screw
 
Dual Heatpipe
   
   




 

 Model
  CL-P0303
Heatsink Dimension 86.5 x 76.2 x 50.29 mm
Heatsink Material Cu Base w/ Cu Fin
Socket Type LGA 771
Fastener Spring Screw
Fan Dimension 70 x 70 x 15 mm
Air Flow 23.49 CFM
Air Pressure 2.23 mmH2O
Bearing Type 1 Ball & 1 Sleeve
Fan Speed 3600 RPM (PWM)
Noise Level 29.1 dBA
Connector 4 Pin
Life Expectation 40,000 hrs
TIM Dow Corning 5022
Total Weight 699 g
   
   
   
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